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PCB Manufacturing Capabilities

From NDA to delivery — PCB fabrication, BOM procurement, and assembly, all managed under one roof.

Technical Specifications

PCB Board Specifications

Our manufacturing parameters cover a wide range of applications, from simple single-sided boards to complex 40-layer HDI constructions.

Parameter

Specification

Layer Count

1 – 40 layers

Board Thickness

0.21mm – 10.0mm

Min. Line / Space

90µm / 75µm (3.5/3.0 mil)

Min. Drill Size (Mechanical)

0.20mm

Min. Drill Size (Laser)

0.10mm

Max. Aspect Ratio

16:1

Copper Weight

0.5oz- 6oz (20oz feasible for prototypes)

Min. Annular Ring

0.10mm

Impedance Tolerance

±10% (±5% achievable)

Max. Panel Size

620mm × 750mm

Board Material

FR-4, High Tg FR-4, Rogers, Aluminum, PI, PTFE

Product Showcase

Advanced PCB Types We Manufacture

From standard FR4 to the most complex constructions — every board type, every surface finish, under one roof.

HDI PCB

Microvias, blind/buried vias, and fine-line technology for smartphones, wearables, and compact devices.

Flexible PCB

Polyimide-based flexible circuits for dynamic bending applications — medical, automotive, and consumer electronics.

Rigid-Flex PCB

Seamless integration of rigid and flexible sections for 3D packaging and reduced connector count.

High-Speed / High-Frequency

Impedance-controlled boards with low-loss materials for 5G, RF, microwave, and high-speed digital applications.

Heavy Copper PCB

Up to 6oz copper for high-current power applications — automotive, industrial, and power electronics.

Multi-Layer PCB

Up to 40 layers with blind/buried vias, controlled impedance, and high-density interconnect.

Quality Assurance

Inspection & Testing Methods

Every board undergoes rigorous inspection and testing at critical production stages to guarantee quality.

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AOI Inspection

Automated Optical Inspection at inner and outer layer stages to detect defects before lamination and final finish.

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X-Ray Analysis

X-ray inspection for multi-layer boards, BGA pads, and hidden defects that visual inspection cannot detect.

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Electrical Testing

Flying probe and fixture-based electrical testing to verify connectivity, isolation, and impedance compliance.

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Microsection Analysis

Cross-sectional microscopic analysis of plated through-holes, copper thickness, and layer alignment.

End-to-End Process

Project Work Flow

A disciplined, stage-gated process that takes your project from confidential design review all the way to delivery.

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NDA

Your IP is protected. We sign a Non-Disclosure Agreement before any design files are shared.

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DFM Review

Our engineers review your design for manufacturability, catching issues before production.

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Design Settled

Design files are finalized with all DFM feedback incorporated — your golden data set.

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Cost Review

Transparent cost breakdown based on final design — no surprises, no hidden fees.

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Fabrication

Boards enter production with full traceability, AOI, and in-process quality checks.

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BOM Prep

Components are checked for supply stability and authenticity, with secure buffer stock ready for assembly.

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Assembly

SMT/THT assembly in China with full inspection and testing.

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Testing

Functional testing, ICT, and burn-in per your specifications before shipment.

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Packing

ESD-safe packaging with moisture protection, barcode labeling, and full documentation.

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Deliver

International logistics via DHL, FedEx, UPS, or your preferred forwarder.

Supply Chain Services

BOM Procurement

Complete component sourcing and procurement management — we handle your bill of materials so you can focus on your product.

Full BOM Management

We source and procure all components from your BOM — semiconductors, passives, connectors, and electromechanical parts — from authorized distributors and verified channels. All components are tracked with lot traceability from receipt to assembly.

Global sourcing from authorized distributors
(Digi-Key, Mouser, Arrow, Avnet & more)

Alternative part recommendations for long lead-time or EOL components

Consigned inventory management — we can hold your stock

Full lot traceability: batch number, date code, distributor source

Component Quality Control

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Visual Inspection

All incoming components undergo visual inspection under microscope — checking for physical damage, marking consistency, pin straightness, and packaging integrity.

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Dimensional Verification

Sample measurements against manufacturer datasheets to verify package dimensions, lead pitch, and coplanarity meet specifications.

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Authenticity Assurance

We source exclusively from authorized channels. For critical or hard-to-find parts, additional authenticity checks include marking consistency, date code logic, and manufacturer documentation verification.

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ESD & MSL Control

All components are handled in ESD-protected environments. Moisture-sensitive devices are stored in dry cabinets and baked per J-STD-033 before assembly when required.

Beyond the Board

Assembly Services – Manufacturing & Sourcing

Flexible assembly options with in-house manufacturing and partner factory sourcing — choose the approach that best fits your cost, compliance, and project requirements.

In-house Manufacturing

🌐 Partner Factory Sourcing

Your dedicated project manager oversees the entire process — whether in-house or through our partner network. Same quality, one window contact.

Surface Finishes

Available Surface Finishes

We offer all major surface finish options to suit your assembly requirements.

HASL

Hot Air Solder Leveling — Leaded / LF Both are available

ENIG

Electroless Nickel Immersion Gold — excellent solderability, wire bonding

OSP

Organic Solderability Preservative — flat surface, environmentally friendly

Immersion Silver

Flat surface, good for fine-pitch components

Immersion Tin

Flat surface, aluminum wire bonding compatible

ENEPIG

Electroless Ni/Electroless Pd/IG — superior wire bonding & corrosion resistance

Ready to Start Your Project?

From NDA to delivery — Get a quote or reach out to discuss your detailed requirements.